How to evaluate the effect of cleaning fluid on SMT solder paste steel mesh cleaning?
Publish Time: 2025-02-27
In the SMT (surface mount technology) production process, the effect of SMT solder paste steel mesh cleaning directly affects the subsequent printing quality and overall production efficiency. Therefore, it is crucial to evaluate the cleaning effect of cleaning fluid on SMT solder paste steel mesh. The following are some commonly used evaluation methods:First, visual inspection is the most basic and direct method. By using a magnifying glass or optical microscope, carefully observe the cleaned steel mesh to check whether there is solder paste residue, flux traces or other contaminants. This method is simple and easy to use, but it may not detect tiny particle residues or ionic contaminants.Secondly, the particle counting method provides a more accurate evaluation method. Before and after cleaning, a high-precision particle counter is used to count and size analyze the tiny particles on the surface of the steel mesh. By comparing the number and size changes of particles before and after cleaning, the ability of the cleaning fluid to remove tiny particles can be quantitatively evaluated. This method is particularly suitable for application scenarios with extremely high cleanliness requirements.In addition, the solvent extraction test method (also known as the ionic contamination test) is also an effective evaluation method. It immerses the cleaned steel mesh in a specific test solution and evaluates the content of ionic contaminants by measuring the resistivity of the extracted solution. The test results are usually expressed as equivalent NaCl content in micrograms per square centimeter. This method can detect residual ionic contaminants in the cleaning solution and ensure that the cleanliness of the steel mesh meets production requirements.In addition to the above methods, the effect of the cleaning solution can also be indirectly evaluated by observing the quality of the printed PCB board. If the solder paste on the printed PCB board is fully filled, the pattern is clear, and the short circuit rate is low, then it can be preliminarily judged that the cleaning solution has a good cleaning effect on the steel mesh. On the contrary, it may be necessary to adjust the parameters such as the concentration, temperature or cleaning time of the cleaning solution.Finally, the operating stability of the equipment is also an important indicator for evaluating the effect of the cleaning solution. If the cleaned steel mesh can keep the nozzle of the equipment unobstructed, the scraper wear is normal, and the failure frequency is low during use, then it means that the cleaning solution has a good cleaning effect on the steel mesh, which helps to extend the service life of the equipment and improve production efficiency.In summary, evaluating the cleaning effect of cleaning fluid on SMT solder paste steel mesh cleaning requires the comprehensive use of multiple methods, from visual inspection to precise measurement to observation of actual application effects, to ensure that the cleanliness of the steel mesh meets production requirements, thereby improving overall production efficiency and product quality.
